技術推廣表-半導體業後段封裝製程微結構之自動化光學量測技術AOI Measurement for Microstructures in Back-End Packaging Processes of The Semiconductor Industry
File size: 630kb
Date of Announcement：2025/12/22
1、Technology：AOI Measurement for Microstructures in Back-End Packaging Processes of The Semiconductor Industry
2、Inventor：Prof. Liang-Chia Chen/Department of Mechanical Engineering, National Taiwan University
3、Enterprise Eligibility：
(1)Industry Category：Precision engineering and manufacturing, semiconductor manufacturing.
(2)Required Technical Know-how：Equipment makers in the above industrial sectors.
(3)Required Machinery and Equipment：General equipment modules or components for automation.
(4)Required Research or Technical Staff：Technical background in precision engineering and manufacturing.
(5)Other Requirements：No specific requirements.
4、How to apply：Please go to the Center of Industrial-Academic Cooperation of the Office of Research and Development to inquire about relevant information.
5、Announcement period：Applications will be accepted from the announcement date.
6、Contact window:
Intellectual Property & Licensing Manager：Donald Lee
TEL：+886-2-3366-9950
Email：hsinyenlee@ntu.edu.tw
